Get ready to witness a significant upgrade in the world of smartphones! In early 2025, Redmi is set to launch its new Turbo 4 model, and what’s special about this device is that it will be the first phone to feature the latest MediaTek Dimensity 8400-Ultra chipset. Yes, you read that right – Ultra!
MediaTek recently launched its Dimensity 8400 SoC, and Realme has confirmed that one of its future handsets will be powered by this processor. A reliable tipster claims that it could be the Realme Neo 7 SE, which is expected to join the recently launched Realme Neo 7 in China.
Redmi has officially confirmed the news on Weibo, stating that its Turbo 4 phone will be the first to don the MediaTek Dimensity 8400-Ultra SoC. Previous leaks had suggested that the device would hit the Chinese market by January 2025. The leaked design render reveals a dual rear camera setup and a flat display with super-slim bezels – a true masterpiece!
On the other hand, Realme has teased the launch of a new smartphone featuring the same MediaTek Dimensity 8400 SoC. Although the company hasn’t revealed the name of the device, a tipster has suggested that it could be the Realme Neo 7 SE.
So, what’s special about the MediaTek Dimensity 8400 chipset? It boasts eight Arm Cortex-A725 cores, with a primary core clocking at 4.32GHz. It’s paired with the Arm Mali-G720 GPU and supports up to LPDDR5x RAM and UFS 4.0 onboard storage. The processor also features a MediaTek NPU 880, which enables it to perform advanced AI tasks.
One of the key highlights of the Dimensity 8400 SoC is its inbuilt MediaTek Imagiq 1080 ISP, which allows for better low-light performance and faster focus. This chipset supports up to 320-megapixel camera sensors and displays with up to WQHD resolution and 144Hz refresh rate.
Stay tuned for more updates on these upcoming smartphones!